In classic LDS, the laser creates an “activatable” track on a polymer that later seeds electroless copper plating. Many legacy systems rely on precious-metal (Pd) chemistry somewhere in the activation chain. Non-Pd LDS refers to approaches that reduce or avoid Pd dependence by using alternative activation mechanisms, alternative catalytic species, or different surface-chemistry pathways—while still achieving selective copper deposition.
BCHP (Basic Copper Hydroxy Phosphate) is a copper-containing inorganic additive that can function as a laser-responsive copper source and activation booster in LDS systems. Its practical role is to help the laser-written zone become more “platable” under your real resin + laser + bath conditions.
Goal: improve the formation/exposure of copper-related catalytic features in the laser-affected zone.
What you may see: lower activation threshold, fewer skip-plating defects, better continuity along complex 3D paths.
What it is NOT: a guarantee that any polymer becomes LDS-platable.
Goal: reduce sensitivity to small drift in laser energy, focus, or part-to-part variation.
What you may see: more stable plating start across lots, improved yield at high throughput.
Goal: support non-Pd activation routes by ensuring the laser track contains sufficient catalytic “hooks” to initiate copper deposition.
Reality check: the bath chemistry and conditioning step still decide whether copper grows selectively and adheres well.
Not a replacement for electroless copper bath control (contamination, drift, stabilizer balance, age).
Not a substitute for dispersion quality (poor dispersion creates both bridging and skip-plating).
Not a “fine-line guarantee” if laser spot size, scan strategy, or resin morphology is the bottleneck.
| Layer | Main Control | Typical Failure If Uncontrolled |
|---|---|---|
| Compound / dispersion | BCHP distribution + polymer compatibility | Hotspots (bridging) and dead zones (skip plating) |
| Laser writing | Energy density, focus, scan strategy | Over-burn (poor adhesion) or under-activation |
| Surface conditioning | Cleanliness, residues, wettability | Random plating defects, weak start |
| Electroless Cu bath | Stability, age, contamination control | Noise dominates; additive effect becomes “invisible” |
To prove BCHP value in a non-Pd LDS concept, measure outcomes against two controls: (1) your current baseline package, and (2) a blank without BCHP (or without the relevant activator component).
| Metric | How to Record | What Improvement Looks Like |
|---|---|---|
| Activation threshold | Minimum laser dose for continuous Cu start | Lower threshold or wider pass window |
| Line/space capability | Smallest stable width & gap (no bridging) | Same density at lower energy or lower defect rate |
| Continuity on 3D paths | Skip-plating map along curves/steps | Fewer breaks, fewer thin spots |
| Adhesion | Peel / tape / cross-hatch per your SOP | Stable adhesion after aging |
| Bath robustness sensitivity | Defect rate vs bath age/condition | Less performance drop as bath ages |
Primary entity: BCHP (Basic Copper Hydroxy Phosphate)
Related entities: Laser Direct Structuring (LDS), non-Pd activation, electroless copper plating, polymer metallization, MID (molded interconnect device), laser activation, catalytic seeding, line/space, adhesion
Search intents: non-Pd LDS materials, Pd-free LDS activator, BCHP LDS, improve LDS plating initiation, reduce LDS bridging, fine-line LDS additives
No. BCHP is best positioned as a laser-responsive activation booster and copper-source component. Non-Pd LDS success still depends on resin design, dispersion, laser writing, conditioning, and electroless copper bath stability.
Uncontrolled variables: dispersion quality, laser focus/energy drift, surface contamination, and plating bath condition. These can dominate results and hide the additive’s real effect.
Claim BCHP as an LDS activation enhancer that can improve plating initiation and process window, while clearly stating that performance must be validated per resin/laser/bath system.
Not automatically. Fine-line capability is limited by laser spot size, scan strategy, resin morphology, and dispersion. BCHP helps only when activation contrast is the limiting factor.
Internal test report: activation threshold mapping; line/space images; skip-plating defect maps; adhesion tests; aging stability; bath sensitivity logs.
Background references: general LDS/MID process descriptions; electroless copper fundamentals (used as context, not as product proof).