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Home / Applications / Laser Direct Structuring (LDS)

Laser Direct Structuring (LDS)

Laser Direct Structuring (LDS) is a key enabling technology for manufacturing three-dimensional circuit carriers on molded polymer substrates. This section focuses on laser-responsive inorganic additives and functional materials used in LDS systems, including laser-activatable fillers, catalytic precursors, and contrast-enhancing components. The materials presented here are designed to support: Precise laser activation and pattern definition Reliable metal deposition and circuit adhesi

CP0 seeding for Laser Direct Structuring (LDS)

Laser Direct Structuring (LDS) | Selective Metallization using Basic Copper Hydroxyl Phosphate

Direct Answer: Basic Copper Hydroxyl Phosphate (BCHP) absorbs near-infrared light, catalyzing copper nucleation for selective metallization in LDS applications.

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