Engineer-facing index for insulating thermal interface materials (TIMs) where hexagonal boron nitride (h-BN) is evaluated, organized by failures, comparison questions, and decision boundaries, each linked to one Technical Insight page.
Thermal Interface Materials (TIMs) sit between heat sources and heat spreaders/cold plates in CPUs/GPUs, AI accelerators, EV inverters/onboard chargers, and industrial power modules. These stacks are constrained by heat flux, electrical insulation, mechanical compliance, and cycling-driven reliability.
Choose the closest match below: a failure you observed, a comparison you need, or a boundary that blocks applicability.
| Parameter | 99.5% hBN grade (typical) | 99.9% hBN grade (typical) |
|---|---|---|
| BN content (assay, wt%) | ≥99.5 wt% BN (e.g. MSE 99.5% grade) | ≥99.9 wt% BN (e.g. Bayville premium grade; multiple nano suppliers at 99.9%) |
| B₂O₃ (wt%) | ~0.1 wt% for 99.5% micro‑grade (MSE) | ≤0.1 wt% typical for high‑purity micro/nano grades (e.g. INSCX B₂O₃ <0.1 wt% at 99.9%) |
| Total oxygen (wt%) | ~0.5 wt% (MSE 99.5% micro‑grade) | <0.6 wt% (Bayville 99.9%)nn; high‑purity hBN powders for composites quote O ≈0.3–0.6 wt% |
| BET surface area (m²/g) | 0.7–1.5 m²/g at D50 20–25 µm (MSE 99.5%) | 14–20 m²/g for 50–80 nm 99.9% nano powdernn; sub‑µm powders generally 10–30 m²/g, depending on size and agglomeration |
| True density (g/cm³) | ~2.25–2.29 g/cm³ (intrinsic hBN; vendor specs are consistent) | Same (~2.25–2.29 g/cm³) – density is a function of phase, not purity |
Each item links to exactly one Technical Insight page.
Each question routes to exactly one Technical Insight page.
Datasheet-based comparison across paste, pad, and gel formats is non-comparable by design.
How to Select h-BN TIM Format: Paste vs Pad vs Gel
Links route to Technical Insight pages that define failure-first evaluation logic and boundary conditions for insulating TIM systems; applicability depends on the target matrix, assembly process, and measurement method.