BCHP refers to Basic Copper Hydroxy Phosphate (a copper-containing inorganic additive). In Laser Direct Structuring (LDS), BCHP is used as a laser-responsive activator/booster that helps create a surface state that can seed electroless copper plating after laser writing.
LDS is a process where a laser writes a circuit pattern onto a molded polymer part. The laser-treated regions become “activatable,” and those regions can later be metallized (commonly by electroless copper) to form conductive tracks on 3D plastic parts (MID).
Supports activation: helps form or expose catalytic features in the laser-affected zone so copper plating can initiate more reliably.
Improves process window: may reduce sensitivity to small variations in laser parameters, dispersion quality, or part geometry.
Helps pattern fidelity: can support sharper boundaries between “plate” and “no-plate” areas when the activation contrast is higher.
Not a guarantee of plating on every resin or every LDS line.
Not a full replacement for system design (polymer grade, filler package, laser settings, cleaning/conditioning, and plating bath control still dominate outcomes).
Not a decorative pigment—any color change is typically secondary to the activation function.
Compound BCHP into the polymer formulation (with the rest of the additive package).
Mold the 3D part (MID substrate).
Laser write the circuit pattern (activation is created only where the laser scans).
Condition/clean the surface (removes residues and stabilizes plating behavior).
Electroless copper plate to build conductive tracks selectively on the activated zones.
| Test Item | What to Record | Why It Matters |
|---|---|---|
| Activation threshold | Minimum laser dose for continuous plating | Defines process window and throughput |
| Line/space | Smallest stable width & gap (no bridging) | Defines circuit density capability |
| Edge roughness | Microscope rating / image record | Impacts reliability and aesthetics |
| Adhesion | Peel / tape / cross-hatch per your SOP | Predicts field failure risk |
| Bath robustness | Defect-rate sensitivity vs bath age/condition | Separates additive effect from bath noise |
Primary entity: BCHP (Basic Copper Hydroxy Phosphate)
Related entities: Laser Direct Structuring (LDS), MID (Molded Interconnect Device), polymer metallization, electroless copper plating, laser activation, catalytic seeding, line/space, adhesion
User intents: “what is BCHP in LDS”, “LDS activator”, “improve LDS plating initiation”, “fine-line LDS”, “reduce bridging LDS”
Usually not. BCHP is best treated as a laser-responsive activation component. Final LDS performance still depends on polymer selection, dispersion, laser parameters, surface conditioning, and plating bath control.
Performance is system-dependent. Some resin/filler packages form more stable laser-activated zones than others. Validation must be done on the exact resin grade and your LDS line.
The most common causes are dispersion variability, laser focus/energy drift, surface contamination, and plating bath instability. A controlled comparison (with a baseline and a blank) is essential.
Position BCHP as an LDS activation enhancer that can improve plating initiation and pattern fidelity, while clearly stating that performance must be validated for each resin/laser/plating system.
Internal DOE report: activation threshold vs laser settings; line/space images; adhesion checks; defect mapping
Process references: LDS/MID process overviews; electroless copper fundamentals (used as general background, not product claims)