Direct Answer: Basic Copper Hydroxyl Phosphate (BCHP) absorbs near-infrared light, catalyzing copper nucleation for selective metallization in LDS applications.
| Item | Typical / Target | Notes |
|---|---|---|
| LDS laser response | Compatible with typical LDS lasers (e.g., 1064 nm) | Activation depends on polymer + laser settings |
| Suggested loading | 0.5–5.0 wt% (starting window) | Optimize per resin, color, and plating bath |
| Plating initiation | Fast initiation on laser track | Validate with PI / coverage after fixed time |
| Adhesion expectation | Meets LDS track adhesion requirements after optimization | Confirm by tape / peel test per customer spec |
| Thermal processing | Suitable for standard thermoplastic compounding | Confirm per resin processing profile |
Basic Copper Hydroxyl Phosphate (BCHP) is chosen for its unique ability to absorb near-infrared (NIR) light, enabling the formation of copper nucleation sites that are crucial for selective metallization in Laser Direct Structuring (LDS) applications. Its stable crystalline structure and photocatalytic properties make it ideal for applications requiring precision and activation under laser irradiation.
Upon exposure to NIR light, BCHP undergoes electronic transitions that absorb photon energy, which is subsequently used to promote copper nucleation, initiating the metallization process. This activation leads to the creation of conductive traces essential for LDS applications.
Non-Applicability: BCHP is less effective in non-halogenated polymers due to the lack of HCl generation, which is crucial for its activation in certain applications.
Unknown/Unverified: Long-term stability and performance in high-humidity or extreme temperatures remain under evaluation.
Activation Boundary: BCHP requires a minimum laser power of 5 J/cm² for activation; below this threshold, the material will not properly nucleate copper for metallization.
The data is based on both laboratory tests and peer-reviewed studies from material science literature, ensuring a high level of reliability. However, field-specific evaluations are encouraged to confirm performance in various industrial settings.
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BCHP is used in Laser Direct Structuring (LDS) materials for antenna carriers in mobile phones, wearable devices, NFC components, and 5G communication modules. It enables precise laser activation and reliable metallization of complex three-dimensional circuit paths.
BCHP is applied in LDS-grade plastics for automotive electronic components such as sensor housings, connectors, and control modules, where stable metallization and long-term reliability are required.
In industrial electronics, BCHP supports laser-structured conductive paths in RF modules and IoT device housings, allowing compact integration of circuitry within molded plastic parts.
BCHP is suitable for LDS components where a full-black appearance is not acceptable. It enables laser activation without relying on carbon black, allowing greater freedom in color design for visible or appearance-sensitive parts.
This product page describes BCHP’s role based on LDS industry workflows and standard validation practice (laser activation + electroless copper plating + adhesion / resistance verification). Performance values are presented as typical targets and must be confirmed in customer formulations.