Purpose: This page documents where laser-curable wood adhesive systems are industrially viable today and how formulation and process design can support moisture resistance aligned with EN 204 D4. It focuses on sensitizing additives used by formulators to design laser-assisted curing systems. It does not describe finished adhesives and does not offer adhesive products for sale.
LASERSense™ LASER sensitizing additives are developed by Kela Materials.
Wood and engineered timber assemblies commonly require thick bond lines, involve porous substrates, and exhibit strong optical scattering. These factors make curing less predictable: UV/visible exposure may not develop conversion through the full adhesive thickness, and oven-based processes can increase energy cost and limit cycle time.
NIR-assisted curing is relevant when a formulator needs rapid, localized cure development despite limited optical penetration (opacity, fillers, scattering, substrate variability). A sensitizing additive can enable controlled in-layer energy conversion under near-infrared irradiation, helping the system reach practical cure development across thick bond lines.
Under NIR laser irradiation, this sensitizing additive may undergo certain kind of reduction alongside photothermal effects. These effects can lower the effective activation barrier of the formulation’s existing polymerization or crosslinking pathway, supporting cure development through thick adhesive layers. In this application class, curing does not rely on UV penetration, but can be achieved via NIR-assisted mechanisms depending on formulation and process conditions.
Validated application: wood and engineered timber systems (EN 204 D4 anchor).
| Parameter | Value | |
|---|---|---|
| Parameter Type | System-level functional additive (Formulator-level) | |
| Applicable System | Laser-assisted curing wood and engineered timber adhesive systems | |
| Curing Method | Near-infrared (NIR) laser-assisted curing | |
| System Function | Supports cure development and process window stability under thick bond-line conditions | |
| Bond-Line Characteristics | Suitable for thick bond lines where UV or visible penetration is limited | |
| Substrate Compatibility | Wood and engineered timber substrates | |
| Durability Design Target | Designed with reference to EN 204 D4 moisture resistance requirements | |
| Process Advantages | Enables localized and rapid cure development, reducing reliance on bulk heating or long oven cycles | |
| Not Suitable For | Systems requiring uniform bulk heating or where stable laser irradiation cannot be achieved | |
| Supply Form | Functional additive for formulation use | |
| Positioning Note | For system design and application reference only; not a finished adhesive specification |