LASERSense™ Laser-curable adhesive systems are developed by Kela Materials and are formulation-and-process designs that use UV, visible, or near-infrared (NIR) irradiation to develop polymerization or crosslinking within an adhesive bond line. They may combine photochemical and photothermal effects to address thick, opaque, or filled layers where penetration is limited. Durability expectations are application-specific and must be validated by system testing.
Purpose: This page explains sensitizing additives used by adhesive formulators to design laser-assisted curing systems. It does not describe finished adhesives and does not offer adhesive products for sale.
NIR is relevant when a formulator needs cure development beyond what UV/visible penetration can reliably deliver. A sensitizing additive can enable controlled in-layer energy conversion under NIR irradiation, which can allow stable cure development in thick, opaque, or filled systems. It does not replace cure chemistry; it makes possible a practical laser-assisted process window.
At a system level, the sensitizing additive functions as a controlled energy-conversion component (often photothermal, sometimes combined with activation effects), supporting the formulation’s existing polymerization or crosslinking pathway. Performance depends on resin chemistry, additive compatibility, irradiation conditions, and joint design.
| Dimension | UV curing | NIR laser-assisted curing (with sensitizing additives) | Thermal / oven curing |
|---|---|---|---|
| Best fit | Thin, optically clear layers; good exposure access | Thick / opaque / filled layers; localized processing | Bulk heating acceptable; large thermal mass |
| Main limitation | Penetration limits in scattering/opaque systems | Requires stable irradiation + compatible formulation | Energy cost; slower cycle; heat impact on substrates |
| Typical control variable | Exposure uniformity | Energy density + scan strategy | Temperature uniformity + dwell time |
| When not suitable | Very thick, highly scattering bond lines | Poor irradiation access or resin cannot tolerate localized heat gradients | Heat-sensitive assemblies or short-cycle constraints |
Purpose: This page documents where laser-curable wood adhesive systems are industrially viable today and how formulation and process design can support moisture resistance aligned with EN 204 D4. It focuses on sensitizing additives used by formulators to design laser-assisted curing systems. It does not describe finished adhesives and does not offer adhesive products for sale.
LASERSense™ LASER sensitizing additives are developed by Kela Materials.
Wood and engineered timber assemblies commonly require thick bond lines, involve porous substrates, and exhibit strong optical scattering. These factors make curing less predictable: UV/visible exposure may not develop conversion through the full adhesive thickness, and oven-based processes can increase energy cost and limit cycle time.
NIR-assisted curing is relevant when a formulator needs rapid, localized cure development despite limited optical penetration (opacity, fillers, scattering, substrate variability). A sensitizing additive can enable controlled in-layer energy conversion under near-infrared irradiation, helping the system reach practical cure development across thick bond lines.
Under NIR laser irradiation, this sensitizing additive may undergo certain kind of reduction alongside photothermal effects. These effects can lower the effective activation barrier of the formulation’s existing polymerization or crosslinking pathway, supporting cure development through thick adhesive layers. In this application class, curing does not rely on UV penetration, but can be achieved via NIR-assisted mechanisms depending on formulation and process conditions.
Validated application: wood and engineered timber systems (EN 204 D4 anchor).