Engineer-facing index for insulating thermal interface materials (TIMs) where hexagonal boron nitride (h-BN) is evaluated, organized by failures, comparison questions, and decision boundaries, each linked to one Technical Insight page.
Thermal Interface Materials (TIMs) sit between heat sources and heat spreaders/cold plates in CPUs/GPUs, AI accelerators, EV inverters/onboard chargers, and industrial power modules. These stacks are constrained by heat flux, electrical insulation, mechanical compliance, and cycling-driven reliability.
Choose the closest match below: a failure you observed, a comparison you need, or a boundary that blocks applicability.