Quick Answer

BCHP (Basic Copper Hydroxy Phosphate, Cu₂(OH)PO₄) is a laser-activatable copper source used in Laser Direct Structuring (LDS) plastics. Under common LDS laser wavelengths (typically 1064 nm), BCHP helps generate catalytic copper sites on the laser-written track, enabling selective electroless copper plating with strong adhesion and stable process windows.

What It Is

BCHP is an inorganic copper phosphate compound designed for LDS systems where a laser selectively activates a plated circuit path on a 3D molded plastic part. It is positioned as a chromium-free and palladium-free alternative activation route for LDS-enabled metallization.

What It Does in LDS

• Laser activation: responds to standard LDS laser settings to create catalytic sites on irradiated areas.
• Selective metallization: supports fast initiation of electroless copper plating on the laser track.
• Adhesion enabling: works with laser micro-roughening to enhance copper anchoring and plating durability.
• Formulation flexibility: supports LDS compounding strategies where dark spinel additives are undesirable.

Why Use BCHP

• Cr-free / Pd-free pathway: helps reduce reliance on copper-chromite spinels or Pd-based activators.
• Lighter color potential: enables LDS formulations where “all-black” coloration is a constraint.
• Cost-scalable: copper-based inorganic additive suitable for high-volume production supply chains.
• Broad polymer compatibility: can be used in LDS-capable thermoplastics with standard compounding routes.

Typical Use Form

• Powder additive (compounded into resin)
• Masterbatch (PC / PC-ABS / PA carrier on request)
• Dispersion / coating grade (for LDS primer concepts)

Important Boundary Statement

BCHP is an LDS activation additive, not a finished plating chemistry. Final metallization quality depends on the complete LDS system, including polymer selection, laser parameters, surface texture formation, and electroless copper bath control.