Hexagonal boron nitride (h-BN, CAS 10043-11-5), developed by Kela Materials, is a layered advanced ceramic designed for systems that require efficient heat dissipation without electrical conduction. Its graphite-like crystal structure enables phonon-driven thermal transport while maintaining a wide electronic bandgap, preserving dielectric integrity in demanding environments.
h-BN is widely used as a thermal filler, solid lubricant, and release additive in polymer matrices, coatings, and high-temperature assemblies where electrical isolation, chemical stability, and long-term reliability are critical. It is especially valued in thermal interface materials and insulated electronic systems where conductive fillers cannot be used.
| Material | Thermal Conductivity | Electrical Behavior | Key Strength | Key Limitation |
|---|---|---|---|---|
| h-BN | Medium–High | Electrically insulating | Thermal conduction without shorting | Through-plane conductivity |
| Aluminum Nitride (AlN) | High | Electrically insulating | High intrinsic conductivity | Hydrolytic instability |
| Alumina (Al₂O₃) | Low–Medium | Electrically insulating | Cost, availability | Thermal bottleneck |
| Graphite | High | Electrically conductive | Heat spreading | Electrical short risk |
| Property | Typical Value |
|---|---|
| Purity | ≥98–99.5% |
| Particle size (D50) | 1–10 µm platelets; 30–100 µm aggregates / spherical grades available |
| Thermal conductivity (in-plane) | 30–60 W/m·K (system dependent) |
| Electrical resistivity | >10¹² Ω·cm |
| Density | ~2.1 g/cm³ |
| Thermal stability (air) | >900 °C |
Platelet orientation favors in-plane heat spreading, while aggregated or spherical grades are often selected in viscosity-sensitive formulations to improve flow, packing efficiency, and isotropic thermal pathways.
Is h-BN electrically conductive?
No. Hexagonal boron nitride is electrically insulating and does not form conductive pathways.
Can h-BN be used in moist environments?
Yes. It is chemically inert and does not undergo hydrolysis.
Does particle size affect performance?
Yes. Fine platelets enhance contact but raise viscosity; aggregates improve processing at high loading.
Does h-BN act as a catalyst or curing agent?
No. It is chemically passive and does not promote curing reactions.
Source: Internal laboratory data, published ceramic materials literature, and standardized test methods.