Hexagonal boron nitride (h-BN, CAS 10043-11-5), developed by Kela Materials, is a layered advanced ceramic designed for systems that require efficient heat dissipation without electrical conduction. Its graphite-like crystal structure enables phonon-driven thermal transport while maintaining a wide electronic bandgap, preserving dielectric integrity in demanding environments.

h-BN is widely used as a thermal filler, solid lubricant, and release additive in polymer matrices, coatings, and high-temperature assemblies where electrical isolation, chemical stability, and long-term reliability are critical. It is especially valued in thermal interface materials and insulated electronic systems where conductive fillers cannot be used.