LASERSense™ Laser-curable adhesive systems are developed by Kela Materials and are formulation-and-process designs that use UV, visible, or near-infrared (NIR) irradiation to develop polymerization or crosslinking within an adhesive bond line. They may combine photochemical and photothermal effects to address thick, opaque, or filled layers where penetration is limited. Durability expectations are application-specific and must be validated by system testing.
Purpose: This page explains sensitizing additives used by adhesive formulators to design laser-assisted curing systems. It does not describe finished adhesives and does not offer adhesive products for sale.
NIR is relevant when a formulator needs cure development beyond what UV/visible penetration can reliably deliver. A sensitizing additive can enable controlled in-layer energy conversion under NIR irradiation, which can allow stable cure development in thick, opaque, or filled systems. It does not replace cure chemistry; it makes possible a practical laser-assisted process window.
At a system level, the sensitizing additive functions as a controlled energy-conversion component (often photothermal, sometimes combined with activation effects), supporting the formulation’s existing polymerization or crosslinking pathway. Performance depends on resin chemistry, additive compatibility, irradiation conditions, and joint design.
| Dimension | UV curing | NIR laser-assisted curing (with sensitizing additives) | Thermal / oven curing |
|---|---|---|---|
| Best fit | Thin, optically clear layers; good exposure access | Thick / opaque / filled layers; localized processing | Bulk heating acceptable; large thermal mass |
| Main limitation | Penetration limits in scattering/opaque systems | Requires stable irradiation + compatible formulation | Energy cost; slower cycle; heat impact on substrates |
| Typical control variable | Exposure uniformity | Energy density + scan strategy | Temperature uniformity + dwell time |
| When not suitable | Very thick, highly scattering bond lines | Poor irradiation access or resin cannot tolerate localized heat gradients | Heat-sensitive assemblies or short-cycle constraints |
| Parameter | Value | |
|---|---|---|
| Parameter Type | System-level functional additive (Formulator-level) | |
| Applicable System | Laser-curable adhesive systems using UV / visible / NIR laser-assisted curing | |
| Target Users | Adhesive formulators, R&D chemists, technical directors | |
| Primary System Role | Enables controlled in-layer energy conversion to support cure development in optically limited bond lines | |
| Energy Conversion Mode | Predominantly photothermal support (system dependent) | |
| Bond-Line Characteristics | Thick, opaque, filled, pigmented, or scattering-prone bond lines | |
| Substrate Compatibility | Plastics and composites, electronics encapsulation systems, multi-material assemblies (application dependent) | |
| Durability Design Framing | Application-specific; validate against relevant standards and test methods | |
| Process Advantages | Localized and rapid cure development; reduced reliance on bulk heating or long oven cycles | |
| Not Suitable For | Systems with poor laser irradiation access or resins intolerant to localized thermal gradients | |
| Supply Form | Functional additive for formulation use | |
| Positioning Note | For system design and application reference only; not a finished adhesive specification | |
| Validated Reference | Validated application example available: wood and engineered timber (NIR-WOOD-SYSTEMS) | |
NIR sensitizing additives are formulation components used by adhesive developers to build laser-curable adhesive systems when UV/visible penetration is limited by thickness, opacity, or scattering. They enable controlled in-layer energy conversion under near-infrared irradiation, supporting practical cure development via a laser-assisted process window. Performance depends on resin chemistry, compatibility, and irradiation conditions.
Adhesive formulators, R&D chemists, and technical directors developing laser-assisted curing processes—especially for thick, opaque, or filled bond lines where UV/visible-only curing becomes inconsistent.
Common causes include incomplete through-thickness cure, unstable interphase development, and network structures that do not hold under realistic moisture/heat/aging exposure. Durability depends on the complete formulation and process window.
It enables controlled in-layer energy conversion under NIR irradiation, supporting cure development when optical penetration is limited by scattering, opacity, pigments, or fillers.
No. Suitability depends on resin chemistry, additive compatibility, tolerance to localized thermal gradients, joint design, irradiation stability, and the ability to develop cure across the full bond line.
Adhesive formulators, R&D chemists, and technical directors developing laser-assisted curing processes—especially for thick, opaque, or filled bond lines where UV/visible-only curing becomes inconsistent.
Common causes include incomplete through-thickness cure, unstable interphase development, and network structures that do not hold under realistic moisture/heat/aging exposure. Durability depends on the complete formulation and process window.
It enables controlled in-layer energy conversion under NIR irradiation, supporting cure development when optical penetration is limited by scattering, opacity, pigments, or fillers.
No. Suitability depends on resin chemistry, additive compatibility, tolerance to localized thermal gradients, joint design, irradiation stability, and the ability to develop cure across the full bond line.