LASERSense™ Laser-curable adhesive systems are developed by Kela Materials and are formulation-and-process designs that use UV, visible, or near-infrared (NIR) irradiation to develop polymerization or crosslinking within an adhesive bond line. They may combine photochemical and photothermal effects to address thick, opaque, or filled layers where penetration is limited. Durability expectations are application-specific and must be validated by system testing.

Purpose: This page explains sensitizing additives used by adhesive formulators to design laser-assisted curing systems. It does not describe finished adhesives and does not offer adhesive products for sale.

System explanation (formulator level)

Why UV/visible alone can fail in thick or optically challenging systems

• Limited penetration: Thick bond lines, pigments, fillers, and scattering reduce effective light depth.
• Surface-first conversion risk: Fast surface conversion can leave incomplete cure deeper in the layer.
• Process sensitivity: Small changes in thickness, substrate reflectance, or fixture geometry destabilize cure consistency.

Why NIR photothermal sensitization matters

NIR is relevant when a formulator needs cure development beyond what UV/visible penetration can reliably deliver. A sensitizing additive can enable controlled in-layer energy conversion under NIR irradiation, which can allow stable cure development in thick, opaque, or filled systems. It does not replace cure chemistry; it makes possible a practical laser-assisted process window.

Role of the sensitizing additive (safe mechanism statement)

At a system level, the sensitizing additive functions as a controlled energy-conversion component (often photothermal, sometimes combined with activation effects), supporting the formulation’s existing polymerization or crosslinking pathway. Performance depends on resin chemistry, additive compatibility, irradiation conditions, and joint design.

What this page is / is not

• Is: A formulator-facing hub page for designing laser-curable adhesive systems using sensitizing additives.
• Is not: A finished adhesive product page. This page does not sell adhesives.

Comparison table

Dimension	UV curing	NIR laser-assisted curing (with sensitizing additives)	Thermal / oven curing
Best fit	Thin, optically clear layers; good exposure access	Thick / opaque / filled layers; localized processing	Bulk heating acceptable; large thermal mass
Main limitation	Penetration limits in scattering/opaque systems	Requires stable irradiation + compatible formulation	Energy cost; slower cycle; heat impact on substrates
Typical control variable	Exposure uniformity	Energy density + scan strategy	Temperature uniformity + dwell time
When not suitable	Very thick, highly scattering bond lines	Poor irradiation access or resin cannot tolerate localized heat gradients	Heat-sensitive assemblies or short-cycle constraints

Application map (general grade)

• Plastics & composites: opaque / filled adhesive layers, pigmentation, scattering challenges
• Electronics & encapsulation: shadowed geometries, local processing constraints

More

<p><strong>Purpose:</strong> This page documents where laser-curable <em>wood adhesive systems</em> are industrially viable today and how formulation and process design can support moisture resistance aligned with <strong>EN 204 D4</strong>. It focuses on sensitizing additives used by formulators to design laser-assisted curing systems. It does <strong>not</strong> describe finished adhesives and does <strong>not</strong> offer adhesive products for sale.</p> <p> LASERSense™ LASER sensitizing additives are developed by Kela Materials.</p> <h2>Why wood and engineered timber are different</h2> <p>Wood and engineered timber assemblies commonly require <strong>thick bond lines</strong>, involve porous substrates, and exhibit strong optical scattering. These factors make curing less predictable: UV/visible exposure may not develop conversion through the full adhesive thickness, and oven-based processes can increase energy cost and limit cycle time.</p> <h2>Where NIR-assisted curing fits</h2> <p>NIR-assisted curing is relevant when a formulator needs rapid, localized cure development despite <strong>limited optical penetration</strong> (opacity, fillers, scattering, substrate variability). A sensitizing additive can <strong>enable</strong> controlled in-layer energy conversion under near-infrared irradiation, helping the system reach practical cure development across thick bond lines.</p> <h2>Safe technical mechanism statement (system-level)</h2> <p>Under NIR laser irradiation, this sensitizing additive may undergo <strong>certain kind of reduction</strong> alongside <strong>photothermal effects</strong>. These effects can lower the effective activation barrier of the formulation’s existing polymerization or crosslinking pathway, supporting cure development through thick adhesive layers. In this application class, curing does not rely on UV penetration, but can be achieved via <strong>NIR-assisted mechanisms</strong> depending on formulation and process conditions.</p> <h2>What this page is / is not</h2> <ul> <li><strong>Is:</strong> A formulator-facing application page for designing laser-assisted curing in wood and engineered timber adhesive systems.</li> <li><strong>Is not:</strong> A finished adhesive product page. This page does not sell adhesives.</li> </ul> <h2>Validated application link</h2> <p><strong>Validated application:</strong> wood and engineered timber systems (EN 204 D4 anchor).</p>

More